1. High temperature adhesive release film
High temperature adhesive release film (milky white) is mainly used for FPC soft board pressing, the main components are polyester resin and polyethylene resin. With good heat resistance and filling properties, it can effectively improve the production yield of FPC flexible circuit boards.
2. Burning iron plate
burnt iron plate (red) is also called silicon steel plate, burnt iron plate. It is composed of silicon rubber and iron plate. Silicone rubber is elastic and can play a buffering role. After being combined into a fired iron plate, it has the function of heat conduction and improves the level of the press. It is suitable for vacuum pressing and fast pressing heat treatment equipment to process FPC flexible circuit boards.
3. Red and green silicone pad
FPC flexible circuit board laminated silicone pad is also commonly known as green/red silicone plate, silicone rubber plate, silicone rubber or silicone pad. It is mainly used in the production of related FPC flexible circuit boards such as mobile phones, notebook computers, liquid crystal displays, PDAs, digital cameras, LCMs, etc. It is used for heating and buffering in high-temperature production of lamination and hot pressing. Composed of silicone rubber and glass fiber cloth, it has good thermal conductivity, so that the pressed product is heated evenly, especially for the uneven height of the circuit board surface, which has a good covering buffer filling function.
4. Silicon aluminum foil
In the lamination of FPC flexible circuit boards, silicon aluminum foil determines the quality of lamination, and lamination is also the most important process in FPC circuit board factories. Composed of red silicone rubber and silver aluminum foil, it is suitable for heat conduction buffer and release effect of FPC flexible circuit board fast press.
5. Vacuum air bag
is a red silicone rubber product, suitable for FPC vacuum press. It has good filling, cushioning and thermal conductivity. Vacuum airbags are mainly used for vacuum pressing of FPC flexible circuit boards by vacuum presses, and used for fast pressing and processing of FPC flexible circuit boards, CCL copper clad laminates, flexible and rigid boards, multilayer circuit boards, and high-precision circuit boards.
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